Thermal properties, strong adhesion
Used to paste heat sink with IC chips, and be cooling body with good thermal effect
Thermal conductivity : >0.671 W/m-k
Thermal resistance : <0.06 °C-in2/W
Strength of connected buildings:1.5map
Surface curing time 10MIN/25 DEGREE
Net Weight: 5g
Viscosity control better, with just a little more force to remove the heat sink (rotating around a few can be removed),
removed after wipe clean with paper towels.
1x STARS-922 Heatsink Plaster
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